| Product Name |
Notes |
|
18 mm Discrete HFET -- TGF4118-EPU
|
0.5 um gate finger length & die Size 0.914 x 2.057 x 0.102 mm
|
|
12 mm Discrete HFET -- TGF4112-EPU
|
0.5 um gate finger length & die size 0.8330 x 1.804 x 0.1016 mm
|
|
24 mm Discrete HFET -- TGF4124-EPU
|
0.5 um gate finger length & die size 0.914 x 2.057 x 0.102 mm
|
|
2.4 mm Discrete HFET -- TGF4240-SCC
|
0.6 x 1 x 0.1 mm HFET which is suitable for high reliability applications
|
|
DC-10.5 GHz Discrete HFET -- TGF4250-SCC
|
4800 ¦m x 0.5 ¦m HFET which is suitable for high reliability applications
|
|
TGF2023-10,
TGF2023-20
|
55% Maximum PAE, Discrete 10 mm GaN on SIC HEMT
|
|
6 Watt Discrete Power GaN on SiC HEMT -- TGF2023-01
|
55% Maximum PAE, Discrete 125 mm GaN on SIC HEMT
|
|
TGF2023-02
|
55% Maximum PAE, Discrete 2.5 mm GaN on SIC HEMT
|
|
TGF2023-05
|
55% Maximum PAE, Discrete 5 mm GaN on SIC HEMT
|
|
9.6 mm Discrete HFET -- TGF4260-SCC
|
9600 ¦m x 0.5 ¦m HFET which is suitable for high reliability applications
|
|
DC - 12 GHz Discrete HFET -- TGF4230-SCC
|
A 1200 ¦m HFET with a nominal PAE of 55 % at 8.5 GHz
|
|
Discrete MESFET -- TGF1350-SCC
|
All-gold metallization for high reliability recessed gate structure
|
|
PD25025F
|
Application specific performance, 2.5 GHz
|
|
PD27025F (27025)
|
Application specific performance, 2.7 GHz
|
|
1 Watt DC-4 GHz Packaged HFET -- TGF2961-SD
|
Cellular base stations, WiMAX, wireless infrastructure, IF & LO Buffer apps
|
|
AGR09045E (09045),
AGR19045E (19045)
|
High gain, efficiency, and linearity
|
|
AGR19030E (19030)
|
High gain, efficiency, and linearity, integrated ESD protection
|
|
Discrete Transistor -- TGF2960-SD
|
High linearity packaged HFET
|
|
AGR09030E (09030),
AGR09070E (09070),
AGR09085E (09085),
AGR09090E (09090),
AGR09130E (09130),
AGR09180E (09180),
AGR18045E (18045),
AGR18060E (18060),
AGR18090E (18090),
AGR18125E (18125),
AGR19060E (19060),
AGR19090E (19090),
AGR19125E (19125),
AGR19180E (19180),
AGR21060E (21060),
AGR21090E (21090),
AGR21125E (21125),
AGR21180 (21180),
AGR26125E (26125),
AGR26125EF (26125),
AGR26180EF (26180),
PD21120R6 (211206),
PDL400 (400),
PRA1000 (1000),
PTF102003 (102003)
|
High-reliability, gold-metalization process
|
|
AGR18030E (18030)
|
High-reliability, gold-metallization process
|
|
AGR21030E (21030),
AGR21045E (21045),
AGR26045E (26045)
|
Large signal impedance parameters available
|
|
300um Discrete pHEMT -- TGF4350-EPU
|
Low noise floating source configuration
|
|
High-Power Packaged GaAs FET -- CLY2,
High-Power Packaged GaAs FET -- CLY5
|
Power amplifiers for WLAN transceivers
|
|
DC - 20 GHz Discrete Power pHEMT -- TGF2022-60
|
Suitable for high reliability applications with 57% maximum PAE
|
|
DC - 12 GHz Discrete Power pHEMT -- TGF2021-12,
DC - 20 GHz Discrete Power pHEMT -- TGF2022-06,
DC - 20 GHz Discrete Power pHEMT -- TGF2022-12,
DC - 20 GHz Discrete Power pHEMT -- TGF2022-24,
DC - 20 GHz Discrete Power pHEMT -- TGF2022-48
|
Suitable for high reliability applications with 58% maximum PAE
|
|
DC - 12 GHz Discrete Power pHEMT -- TGF2021-01,
DC - 12 GHz Discrete Power pHEMT -- TGF2021-02,
DC - 12 GHz Discrete Power pHEMT -- TGF2021-04,
DC - 12 GHz Discrete Power pHEMT -- TGF2021-08
|
Suitable for high reliability applications with 59% maximum PAE
|