Microprocessors that use a reduced instruction set computer (RISC) design process a few simple instructions rather than many complex ones in order to speed operations.
Microprocessors that use a complex instruction set computer (CISC) design provide variable length instructions, multiple addressing formats, and contain only a small number of general purpose registers
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Data buses are a bidirectional set of conductive paths. Data or instruction codes are transferred into the digital signal processor (DSP). The results of operations and computations are output from the DSP.
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I/O Ports and Interfaces
Input/output (I/O) ports and interfaces are connections to a microprocessor that provide a data path between the microprocessor and external devices such as a keyboard, display, or reader.
Universal asynchronous receiver/transmitter (UART) is a circuit that accepts parallel data information and converts it into an asynchronous serial data stream.
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Direct memory access (DMA)is a method of transferring data directly between two peripherals with minimal processor intervention. Usually, these two peripherals are memory and an I/O device.
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Communication controllers manage data input and output to a host computer or computer network. The units may be complex front-end mainframe interfaces or simpler devices such as multiplexers, bridges, and routers. The devices convert parallel computer data to serial data for transmission over communication lines and perform all the necessary control functions, error checking, and synchronization.
Serial peripheral interface (SPI) is a four-wire, full duplex, synchronous serial data link. SPI was originally developed by Motorola to provide a glueless microcontroller interface to industry-standard serial devices, such as EEPROM, and other serial devices.
The Inter-IC (I2C) bus is a two-wire serial bus designed by Phillips that provides a communications link between integrated circuits. I2Cs are used to control and monitor applications in communications, computer, and industrial settings. Physically, the bus consists of two active wires and a ground connection. The active wires, the serial data line (SDA) and the serial clock line (SCL), are both bidirectional. Each component that is connected to the bus has a unique address and can, depending on its functionality, receive and/or transmit information.
Designed by IBM in 1975, synchronous data link control (SDLC) is the oldest two-layer protocol for carrying system network architecture (SNA) traffic. In 1979, ISO used SDCL to create high-level data link control (HDLC).
The joint test action group (JTAG) created the JTAG interface to allow access to the inner workings of an IC for testing, controlling, and programming purposes.
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Ball grid array (BGA) is a type of memory chip with soldered balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance.
Quad flat packages (QFP) are etched or stamped with fine lead frames. This design enables QFPs to contain more leads and features in a smaller profile (the lead width can be as small as 0.16 mm while the lead pitch is 0.4 mm). The thinner and flexible leads in gull-wing shape also provide better 2nd-level reliability (package to PCB). Quad packages have been used for years to meet increasing challenges of advancing processors/controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipset, video-DAC, multi-media and other related applications. QFPs are widely used in consumer and industrial products, automotive technology, PCs and other related products.
Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
Dual In-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
Plastic dual-in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
Ceramic dual-In-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
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Integrated phase locked loops (PLLs) and delay locked loops (DLLs) with clock frequency synthesis capabilities allow designers to generate high-speed internal clocks for sampling data in microprocessor applications. PLLs and DLLs give designers greater control over the clock frequencies used in integrated designs. This is vital for system integration because different parts of a system operate at different clock frequencies.
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