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EPROM Specifications

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Architecture / Type




   EPROM Type       
   Your choices are...
 
      
 
   EPROM
 
     Erasable programmable ROM (EPROM) chips do not require power to retain their data. Consequently, EPROM chips are commonly used to store BIOS information and basic software for modems, video cards, and other peripherals. EPROMs can be erased by exposure to ultraviolet light and then reprogrammed using a device called a PROM burner.
 
   FEPROM
 
     Flash EPROM (FEPROM).
 
   Other
 
     Other unlisted, specialized, or proprietary EPROM.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Density
 
     The capacity of the memory chip expressed in bits.
 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Number of Words
 
     The number of "rows" in the organization of the memory chip.  Each row stores a memory word and connects to a word line (one line of the memory bus) for addressing purposes.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Bits per Word
 
     The number of "columns" in the organization of the memory chip. Each column connects to a sense / write circuit (a bit), which connects to data input/output lines of the chip.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Bus Type       
   Your choices are...
 
      
 
   Parallel
 
     A general bus where the data bits are sent in groups.
 
   Serial
 
     A general bus where the data bits are sent one at a time.
 
   Serial-1 Wire
 
     A type of communication protocol that uses an I/O pin.
 
   Serial-2 Wire
 
     A type of communication protocol.
 
   Serial-3 Wire
 
     A type of communication protocol.
 
   I2C
 
     Inter-Integrated Circuit (I2C) bus is a two-wire, low to medium speed, communication bus developed by Philips Semiconductors in the early 1980's.
 
   MICROWIRE™
 
     MICROWIRE™ is a serial protocol created by National Instruments.
 
   SPI
 
     The serial peripheral interface (SPI) port was developed by Motorola.
 
   Serial-uPort
 
     A type of communication protocol.
 
   Other
 
     Other unlisted, specialized, or proprietary buses.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Production Status       
   Your choices are...
 
      
 
   Full Production
 
     Devices are currently being manufactured.
 
   Discontinued
 
     Devices are no longer available from the manufacturer, but may still be found in the supply chain.
 
   New Product
 
     Devices are new products that have been announced by the manufacturer. 
 
   Other
 
     Other unlisted status types.
 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Performance




   Access Time
 
     A measurement of time in nanoseconds (ns) used to indicate the speed of memory. Access time is a cycle that begins the moment the CPU sends a request to memory and ends the moment the CPU receives the data it requested. Specifically, for a synchronous device it is the time, usually in ns, from a clock edge to when data is available at the output of a device. For an asynchronous device it is the time from the initiation of the read cycle to when the data output is available.
 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Operating Current
 
     The minimum current needed for active chip operation.
 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Standby Current
 
     The minimum current needed for the operation of the chip while it is inactive.
 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Power Dissipation
 
     Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatts.
 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   OTP
 
     One-time Programmable (OTP) device.
 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Supply Voltage:       
   Your choices are...
 
      
 
   -5 V
 
     The chip operates with -5 volts.
 
   -4.5 V
 
     The chip operates with -4.5 volts.
 
   -3.3 V
 
     The chip operates with -3.3 volts.
 
   -3 V
 
     The chip operates with -3 volts.
 
   1.2 V
 
     The chip operates with 1.2 volts.
 
   1.5 V
 
     The chip operates with 1.5 volts.
 
   1.8 V
 
     The chip operates with 1.8 volts.
 
   2.5 V
 
     The chip operates with 2.5 volts.
 
   2.7 V
 
     The chip operates with 2.7 volts.
 
   3 V
 
     The chip operates with 3 volts.
 
   3.3 V
 
     The chip operates with 3.3 volts.
 
   3.6 V
 
     The chip operates with 3.6 volts.
 
   5 V
 
     The chip operates with 5 volts.
 
   Other
 
     Other unlisted supply voltages.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Logic Family       
   Your choices are...
 
      
 
   L
 
     Low power (L).
 
   S
 
     Schottky (S).
 
   H
 
     High speed (H).
 
   LS
 
     Low power Schottky (LS).
 
   AS
 
     Advanced Schottky (AS).
 
   ALS
 
     Advanced low power Schottky (ALS).
 
   FAST
 
     Fairchild advanced Schottky TTL (FAST) technology was created in late 1970 when advances in IC technology allowed the speed and drive of S-TTL to be combined with the lower power of LS-TTL to form a new logic. An advanced related family is the FASTr, which is faster then FAST, has a higher driving capability (IOL, IOH), and produces much lower noise. The “r” in FASTr refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed.
 
   High-Speed CMOS
 
     High-speed CMOS technology (HCMOS) is also known as HC / HCT. There are several basic flavors of HCMOS technology: high-speed CMOS (HC), high-speed CMOS with TTL input (HCT), advanced high-speed CMOS (AHC), and advanced high-speed CMOS with TTL inputs (AHCT).
 
   HCT
 
     High-speed CMOS with TTL inputs (HCT).
 
   AHC
 
     Advanced high-speed CMOS (AHC).
 
   AHCT
 
     Advanced high-speed CMOS with TTL inputs (AHCT).
 
   Fast CMOS
 
     Fast CMOS technology (FCT) was introduced in 1986. With this technology the speed gap between CMOS and TTL was closed. Since FCT is the CMOS version of FAST, it has the low power consumption of CMOS but speed comparable with TTL. Advanced versions of the FCT standard are FCTx and FCTx-T. The x in FCTx and FCTx-T refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed.
 
   Advanced CMOS
 
     Advanced CMOS is a much higher speed version of HCMOS.  It is also known as AC / ACT.  Advanced CMOS technology comes in different flavors: standard advanced CMOS (AC), advanced CMOS with TTL inputs (ACT), advanced CMOS with quiet outputs (ACQ), advanced CMOS with TTL inputs and quiet outputs (ACTQ), advanced ultra-Low voltage CMOS (AUC), advanced ultra-low power CMOS (AUP), advanced very-low voltage CMOS (AVC), advanced low voltage HCMOS (ALVC), and advanced low voltage CMOS with bus hold (ALVCH).  ACQ / ACTQ are second generation Advanced CMOS with much lower noise. While ACQ has the CMOS input level, ACQT is equipped with TTL level input.
 
   ACT
 
     Advanced CMOS with TTL inputs (ACT).
 
   ACQ
 
     Advanced CMOS with quiet outputs (ACQ).
 
   ABT
 
     Advanced BiCMOS technology (ABT).
 
   ABTE
 
     Advanced BiCMOS technology with enhanced transceiver logic (ABTE).
 
   ABTH
 
     Advanced BiCMOS technology with bus hold (ABTH).
 
   BCT
 
     BiCMOS with TTL inputs (BCT).
 
   BTL
 
     BiCMOS with backplane and transceiver logic (BTL).
 
   Crossbar Technology (CBT)
 
     Crossbar technology (CBT) enables a bus interface to function as a very fast bus switch, isolating the bus when the switch is open and offering very little delay when the switch is closed. Opening the switch provides circuit isolation (high impedance). Closing the switch provides a near-zero propagation delay through a 5-Ohm resistance. Bus switch technology is used in programmable logic devices (PLDs) for improved performance. Typically, CBT devices operate from 4.5 V to 5.0 V. CBT is also known as quick switch (QS), fast switch technology (FST), or Pericom Interface (PI5C).
 
   Futurebus (FB)
 
     Futurebus (FB) and Futurebus+ are back-plane bus specifications that define both the physical and electrical layers. Both bus types can use either asynchronous or synchronized protocols.  When operating with 256 bit transfers, the data rate may be as high as 3200MBps. Futurebus bus widths start at 32 bits wide, while Futherbus+ may have widths may up to 256 bits. Bus widths of 32, 64,128 and 256 are possible at a clock rate of 100MHz. Futurebus card size is defined as 300mm x 300mm, and uses 2mm style connectors.
 
   Gunning Transceiver Logic (GTL)
 
     Gunning transceiver logic (GTL) is a standard for electrical signals in CMOS circuits that is used to provide high data transfer speeds with small voltage swings.
 
   GTLP
 
     Gunning with transceiver logic plus (GTLP).
 
   ALB
 
     Advanced low voltage BiCMOS (ALB).
 
   LV
 
     Standard low voltage CMOS (LV).
 
   LVC
 
     Low voltage high performance HCMOS (LVC).
 
   LVCH
 
     Low voltage CMOS with bus hold (LVCH).
 
   ALVC
 
     Advanced low voltage CMOS (ALVC).
 
   LVT
 
     Low voltage CMOS technology with TTL inputs (LVT).
 
   LVTZ
 
     Low voltage CMOS technology with TTL inputs and high impedance (LVTZ).
 
   ALVCH
 
     Advanced low voltage CMOS with bus hold (ALVCH).
 
   LCX
 
     Low voltage CMOS (LCX) operates with 3 V or 5 V. 
 
   VCX
 
     Low voltage CMOS (VCX) that operates with 1.8 V or 3.6 V.
 
   CBTLV
 
     Low-voltage CBT (CBTLV) features simple N-channel and P-channel metal-oxide semiconductor (MOS) transistors optimized for 3.3 V operation while maintaining low propagation delays and low current supply.
 
   CMOS 4000
 
     CMOS 4000 refers to the 4000 series that is true CMOS with non-TTL levels.
 
   Emitter Coupled Logic (ECL)
 
     Emitter coupled logic (ECL) uses transistors to steer current through gates that compute logical functions. By comparison, TTL and related families use transistors as digital switches, where the transistors are either cut off or saturated, depending on the state of the circuit. This distinction explains ECL's chief advantage: that because the transistors are always in the active region, they can change state very rapidly, so ECL circuits can operate at very high speed; and also its major disadvantage: the transistors are continually drawing current, which means the circuits require high power, and thus generate large amounts of waste heat. ECL gates use differential amplifier configurations at the input stage. A bias configuration supplies a constant voltage at the midrange of the low and high logic levels to the differential amplifier, so that the appropriate logical function of the input voltages will control the amplifier and the base of the output transistor. The propagation time for this arrangement can be less than a nanosecond. Other noteworthy characteristics of the ECL family include the fact that the large current requirement is approximately constant, and does not depend significantly on the state of the circuit. This means that ECL circuits generate relatively little power noise, unlike many other logic types that typically draw far more current when switching than quiescent, for which power noise can become problematic. ECL circuits operate with negative power supplies, and logic levels incompatible with other families, which means that interoperation between ECL and other designs are difficult. The fact that the high and low logic levels are relatively close mean that ECL suffers from small noise margins, which can be troublesome in some circumstances.
 
   Transistor-Transistor Logic (TTL)
 
     Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable, as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL signals are defined as "low" or L when between 0 V and 0.8 V with respect to the ground terminal, and "high" or H when between 2 V and 5 V.

The first logic devices designed from bipolar transistors were referred to as standard TTL. The addition of Schottky diodes to the base collector of bipolar transistor was called Schottky logic (S-TTL). Schottky diodes shorten propagation delays within TTL by preventing the collector from going into what is called “deep saturation.”  Other TTL technologies include low-power Schottky (LS-TTL), advanced Schottky (AS-TTL), advanced low-power Schottky (ALS-TTL), and low-voltage TTL (LVTTL).
 
   Other
 
     Other unlisted or proprietary logic families.
 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Packaging Information




   IC Package Type       
   Your choices are...
 
      
 
   BGA
 
     Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
 
   CSP
 
     Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.  
 
   FLGA
 
     Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
 
   QFP
 
     Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications. 
 
   LQFP
 
     Low quad flat package (LQFP).
 
   TQFP
 
     Thin quad flat package (TQFP).
 
   SOP
 
     Small outline package (SOP).
 
   SOIC
 
     Small outline integrated circuit (SOIC).
 
   TSOP
 
     Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
 
   SSOP
 
     Shrink small outline package (SSOP).
 
   TSSOP
 
     Thin shrink small outline L-leaded package (TSSOP).
 
   TVSOP
 
     Thin very small outline package (TVSOP).
 
   SOJ
 
     Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
 
   HSOF
 
     Small outline flat-leaded package with heat sink (HSOF).
 
   PLCC
 
     Plastic leaded chip carrier (PLCC).
 
   LCCC
 
     Leadless ceramic chip carrier (LCCC).
 
   DIP
 
     Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
 
   SIP
 
     Single in-line package (SIP).
 
   SDIP
 
     Shrink dual in-line package (SDIP).
 
   SZIP
 
     Shrink zigzag in-line package (SZIP).
 
   Other
 
     Other unlisted, specialized, or proprietary IC packages.
 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Package Material       
   Your choices are...
 
      
 
   Plastic
 
     The package material is plastic.
 
   Ceramic
 
     The package material is ceramic.
 
   Metal
 
     The package material is metal.
 
   Glass
 
     The package material is glass.
 
   Other
 
     Other unlisted package materials.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Screening Level       
   Your choices are...
 
      
 
   Commercial
 
     Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications.
 
   Industrial
 
     Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications.
 
   Military
 
     Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications.
 
   Other
 
     Other unlisted screening levels.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count
 
     The number of pins in package or module.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Temperature:
 
     This is the full-required range of ambient operating temperature.
 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
Part Numbers for EPROM

Part # Distributor Manufacturer Product Category Description
MX27C1000-15QC 4 Star Electronics, Inc. MX Not Provided Not Provided
TC574000D150 4 Star Electronics, Inc. TOSH Not Provided Not Provided
TN27C64 4 Star Electronics, Inc. INTEL Not Provided Not Provided
27C256-25 4 Star Electronics, Inc. MCT Not Provided Not Provided
AT27C256R-55PC 4 Star Electronics, Inc. ATM Not Provided Not Provided
MX27C4000DC12 4 Star Electronics, Inc. MAC Not Provided Not Provided
MX27C4000DC90 4 Star Electronics, Inc. MAC Not Provided Not Provided
27C256-25/J 4 Star Electronics, Inc. MCT Not Provided Not Provided
27HC256-55P 4 Star Electronics, Inc. MIC Not Provided Not Provided
AM27C512DC 4 Star Electronics, Inc. AMD Not Provided Not Provided

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