RF bipolar junction transistors (BJTs) are designed to handle high power RF signals, such as signals found in stereo amplifiers, radio transmitters, TV monitors, etc. Bipolar transistors come in a wide variety of physical packages. Package type is primarily dependent upon the power dissipation of the transistor, much like resistors: the greater the maximum power dissipation, the larger the device has to be to stay cool. There are several standardized package types for three-terminal semiconductor devices, any of which may be used to house a bipolar transistor. This is an important fact to consider: there are many other semiconductor devices other than bipolar transistors, which have three connection points. It is impossible to positively identify a three-terminal semiconductor device without referencing the part number printed on it, and/or subjecting it to a set of electrical tests.
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The temperature range supported, and the mechanical and electrical specifications of the device are suitable for general industrial applications, such as aeronautical, automotive, medical, and others.
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TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment.
TO-220 is a transistor outline (TO) package that is suitable for high power, medium current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies.
TO-247 is a large, through-hole, transistor outline (TO) package. TO-247 provides excellent power dissipation and is ideal for metal oxide semiconductor field effect transistors (MOSFETs), high power bipolar transistors, and insulated gate bipolar transistors (IGBTs).
TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers.
SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
SOT82 is a rectangular, surface mounted, small outline transistor (SOT) package with three leads. SOT82 is larger than DPAK and smaller than TO-220, but still comparable to TO-220 in performance. SOT82 lead frames are available in full nickel or selective silver plating and allow wire bonding with gold or aluminum wire. Often, SOT82 is used in over-voltage protection devices in telecommunications equipment. SOT82 is also used to package high power rectifiers, DC to AC converters (DACs) and frequency converters.
SOT89 is a plastic, surface mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL).
SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink. During soldering, the formed leads absorb thermal stress and eliminate the possibility of damage to the die. The encapsulation material enhances device reliability, allowing SOT223 to provide excellent performance in environments with high temperatures and humidity levels. SOT223 provides power dissipation of 1W ~ 1.5W.
TO-251 and TO-252 are low to medium power packages that feature a transistor outline (TO). TO-251 uses through-hole technology (THT). TO-252 uses surface mount technology (SMT). Both packages provide several lead frame choices and are commonly used in home appliances, personal computers, lighting, and automotive systems.
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Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP).
Components are packed in trays that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays.
To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks.
Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.
To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type.
Other unlisted, specialized or proprietary packing methods.
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The measure of the power amplification produced by the transistor. It is generally measured in dB (of the ratio of the output power to the input power).
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The noise figure (NF) is the ratio (in dB) of the signal-to-noise ratio at the input of the component and the signal-to-noise ratio measured at the output. It is a measure of the amount of noise added to the signal during normal operation. A low noise figure means better performance.
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