VO is the output voltage of the device in the off state. It is the voltage across a 20 ohm resistor in series with the device during the discharge of a specified capacitor.
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The breakover voltage symmetry (VBO) is the maximum breakover voltage range around the nominal breakover voltage with a specified capacitance connected in parallel with the device.
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IBO is the breakover current. This is the level (min/max) of the direct voltage at the breakover point, which is where the differential resistance is zero and the principal voltage has reached a maximum value at a specified rate of rise of off state volt. It is the instantaneous current flowing at the breakover voltage (VBO).
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Temperature junction (TJ) is the full-required range of ambient operating temperatures.
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Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
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End of Life Vehicles (ELV) is an EU directive that required certain automotive products to be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum, and in solderable applications.
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Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel.
Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
Other unlisted, specialized or proprietary packages.
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