Go to GlobalSpec.com Home
 

Free Registration 
GlobalSpec Home
Toolbar   The Engineering Toolbar
The Ultimate Resource for Engineering and Technical Research. (Learn More)


Diacs Specifications

What do you want to do?

Show All Diacs Companies

Learn more about Diacs

Search By Specification


Performance




   ITRM
 
     ITRM is the repetitive peak on state current. This is the maximum current for which the device is rated and includes all of the repetitive currents.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   VO
 
     VO is the output voltage of the device in the off state. It is the voltage across a 20 ohm resistor in series with the device during the discharge of a specified capacitor.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   VBO
 
     VBO is the breakover voltage measured between the terminals when the device switches on. It is the voltage at which a device begins to conduct.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Breakover voltage symmetry   (DeltaVBO)
 
     The breakover voltage symmetry (DeltaVBO) is the maximum breakover voltage range around the nominal breakover voltage with a specified capacitance connected in parallel with the device.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   IBO
 
     IBO is the breakover current. This is the level (min/max) of the direct voltage at the breakover point, which is where the differential resistance is zero and the principal voltage has reached a maximum value at a specified rate of rise of off state volt. It is the instantaneous current flowing at the breakover voltage (VBO).
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Pd
 
     Pd is the power dissipated by the device while in the on-state.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   TJ
 
     Temperature junction (TJ) is the full-required range of ambient operating temperatures.
 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
Standards and Certifications




   RoHS Compliant
 
     Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   ELV Directive
 
     End of Life Vehicles (ELV) is an EU directive that required certain automotive products to be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum, and in solderable applications.
 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
Packaging Specifications




   IC Package Type       
   Your choices are...
 
      
 
   DIP / CDIP / PDIP
 
     Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.

Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.

Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
 
   DPAK
 
     Discrete package or deca-watt (DPAK).
 
   D2PAK
 
     D2PAK is large surface mounted package that include a heat sink.
 
   DO-15
 
     DO-15 is a diode outline (DO) package.
 
   DO-35
 
     DO-35 is a diode outline (DO) package.
 
   IPAK
 
     Integrated package (IPAK).
 
   I2PAK
 
     I2PAK is a plastic package with three leads.
 
   PPAK
 
     Power packaging (PPAK).
 
   MELF
 
     Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel.
 
   TO-3
 
     TO-3 is a transistor outline (TO) package with three leads.
 
   TO-3P
 
     TO-3P is a transistor outline (TO) package with three leads.
 
   TO-39
 
     TO-39 is a transistor outline (TO) package.
 
   SOT3
 
     SOT3 is a small outline transistor (SOT) package.
 
   SOT223
 
     SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink.
 
   TO-92
 
     TO-92 is a transistor outline (TO) package. 
 
   TO-202
 
     TO-202 is a transistor outline (TO) package.
 
   TO-220
 
     TO-220 is a transistor outline (TO) package.
 
   TSOP
 
     Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. 
 
   TSSOP
 
     Thin shrink small outline L-leaded package (TSSOP).
 
   TSOJ
 
     Thin small outline J-leaded package (TSOJ).
 
   Other
 
     Other unlisted, specialized or proprietary packages.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count
 
     The number of physical connection points (e.g., pins, pads, balls) on the package.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Diacs in Package
 
     The number of diodes embedded in the chip (package).
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
Part Numbers for Diacs

Part # Distributor Manufacturer Product Category Description
DB3-TP Digi-Key Micro Commercial Co Not Provided DIAC BIDIRECT 150MW 2A DO35
LLDB3-TP Digi-Key Micro Commercial Co Not Provided DIAC BIDIRECT 150MW 2A MINIMELF
K0900GRP Digi-Key Littelfuse / Teccor Brand Thyristors Not Provided SIDAC 79-97VBO 1A DO-15X
K3000F23 Digi-Key Littelfuse / Teccor Brand Thyristors Not Provided SIDAC 270-330VBO 1A TO-202
MKP1V240RL Digi-Key ON Semiconductor Not Provided SIDAC BIDIR 0.9A 240V DO-41
BS08D-112 Digi-Key Powerex Inc Not Provided TRIGGER BILTRL SW 175MA TO-92
K2400EH70 Digi-Key Littelfuse / Teccor Brand Thyristors Not Provided SIDAC 220-250VBO 1A H-ENERG TO92
K2501G Digi-Key Littelfuse / Teccor Brand Thyristors Not Provided SIDAC 240-280VBO 1A MULT-P DO15
K2400E70 Digi-Key Littelfuse / Teccor Brand Thyristors Not Provided SIDAC 220-250 VOLTS TO-92
ST34BRP Digi-Key Littelfuse / Teccor Brand Thyristors Not Provided DIAC 32-36 VOLTS SMT DO-214AA

More >>


Find Companies by Name
View Diacs Datasheets