RF and Wireless Chips Specifications

Technology / Interface


	Technology
	Your choices are...
	ANT		ANT is a digital radio system technology for personal-area networking (PAN).
	Bluetooth		Bluetooth^® chips provide wireless connectivity in solution-on-chip (SoC) platforms that power short-range radio communication applications. Bluetooth is a registered trademark of Bluetooth SIG, Inc.
	CDMA		Code division multiple access (CDMA) is a digital, wireless transmission standard.
	EDGE		An enhanced data rate for global revolution (EDGE) is a digital wireless technology that enables mobile service providers to deliver multimedia, high-speed Internet access, and email. EDGE chips are considered to be an intermediate step between 2G technologies and 3G technology. They are a step up from the GSM standard, but do not provide the same quality as an UMTS chip.
	Ethernet		Ethernet is a local area network (LAN) protocol that uses a bus or star typology and supports data transfer rates of 10 Mbps. The Ethernet specification is the basis for the IEEE 802.3 standard, which specifies the physical and lower software layers. To handle simultaneous demands, Ethernet uses carrier sense multiple access / collision detection (CSMA/CD) to monitor network traffic.
	Fast Ethernet		Fast Ethernet is a networking standard that supports data transfer rates up to 100 Mbps. There are two types of Fast Ethernet: 100Base-X and 100Base-T. 100Base-X uses two physical links, one for transmission and one for reception, between nodes. 100Base-T uses medium access control protocol (MAC). The IEEE 802.3 committee developed the standards for Fast Ethernet.
	Gigabit Ethernet		Gigabit Ethernet is an Ethernet technology that supports frame transmission at rates above gigabits.
	HSDPA		High-speed downlink packet access (HSDPA) is a packet-based mobile protocol.
	IrDA		Infrared data access (IrDA) is a protocol for exchanging data between devices by using infrared signals. IrDA is one of the most powerful wireless protocols.
	3G Standard		Third generation (3G) chips and chipsets include UMTS, EDGE, and GMS products. IMT-2000, a global standard, was developed by the International Telecommunication Union (ITU) in order to codify the technical specifications for global 3G wireless technology.
	4G Standard		Fourth generation (4G) wireless technology is the successor to the 3G standard. 4G is based only on packet switching. By contrast, 3G uses a combination of circuit and packet switching.
	GPS		Global positioning system (GPS) chips compare signals from several geo-positioning satellites to determine position on the Earth's surface.
	GPRS		GPRS chips use general packet radio service (GPRS), a standard for wireless communication with a throughput rate of 115 kilobits per second.
	GSM		Global system for mobile communications (GSM) is a 3G standard popular in Europe and Japan.
	Multiprotocol		Multiprotocol interfaces support more than one protocol, such as V.36, V.28, RS232, and V.35, etc.
	UMTS		Universal mobile telecommunications system (UMTS) is a 3G wireless protocol.
	USB		Universal serial bus (USB) is a 4-wire, 12-Mbps serial bus for low-to-medium speed peripheral device connections to personal computers (PC), including keyboards, mice, modems, printers, joysticks, audio functions, monitor controls, etc. The USB design is standardized by the USB Implementers Forum (USBIF), an organization that includes leading companies from the computer and electronics industries. The current USB specification is USB 2.0, which supports data transfer rates of up to 480 Mbps.
	VoIP		Voice over IP (VoIP) interfaces.
	WCDMA		Wide band code division multiple access (WCDMA) is a wireless protocol for wideband communication.
	Wi-Fi / WiMAX / Wi-Mesh		WiFi (802.11) and WiMAX (802.16) wireless Ethernet chips are used in fixed broadband wireless access networks that use point-to-multipoint architecture. WiFi chips are based on the IEEE 802.11 standard. WiMAX chips are based on the IEE 802.16 standard. WiFi is an abbreviation for wireless fidelity. WiMAX is an abbreviation for worldwide interoperability for microwave access. The IEEE 802.16 or WiMAX standard is also known as WirelessMAN^®, a registered trademark of the Institute of Electrical and Electronics Engineers (IEEE). Wi-Mesh is designed to extend the reach of WiFi networks over long distances by allowing multiple access points to carry each others' traffic. Unlike Wi-Fi hotspots, which need a direct connection to the Internet, mesh networks pass the data request until a network connection is found.
	ZigBee		ZigBee chips (802.15.4) are a cost-effective, standards-based, wireless networking solution that provides low data-rates, low-power consumption, security, and reliability.
	Other		Other unlisted or proprietary technology types.
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	Interface
	Your choices are...
	CompactPCI (cPCI) / PXI		Compact PCI (cPCI) is a high-performance industrial bus that uses the electrical standards of the PCI bus and is packaged in a Eurocard. Specifications for the CompactPCI bus are developed and maintained by the PCI Industrial Computers Manufacturers Group (PICMG). cPCI buses are used extensively in systems that require high speed data transfers. Examples include data communication routers and switches, real-time machine control, real-time data acquisition, military systems, etc.
	Fibre Channel		Fibre channel is a high-speed, serial data transfer architecture that uses links of twisted-pair, coaxial, or fiber optic cable. Small computer system interface (SCSI) devices can use fibre channel arbitrated loop (FC-AL), the most popular fibre channel typology. Using optical fiber, FC-AL supports full-duplex data transfer rates of 100 Mbps. Eventually, FC-AL is expected to replace SCSI in high-performance storage systems.
	IEEE 1394 (FireWire^®)		IEEE 1394 or FireWire^® is an interface standard adopted by the Institute of Electrical and Electronics Engineers (IEEE) for very fast digital data transfers such as streaming video. IEEE 1394 connectors are used to transmit and receive data among FireWire devices, and are designed to replace external high-speed peripheral connections to personal computers, including hard disks, CD-ROMs, DVDs, graphics cards, high-speed scanners, direct video, monitors, etc. Tiny, robust FireWire connectors will also become important parts of home entertainment, communication, and appliance networks. FireWire is a registered trademark of Apple Computer, Inc.
	I²C		Inter-integrated circuit (I²C) bus is a two-wire, low to medium speed, communication bus.
	PCI		Peripheral component interconnect (PCI) is a local bus system designed for high-end computer systems. PCI buses transfer 32 or 64 bits of data at a clock speed of 33 MHz. They also support 3 to 5 critical peripherals, which are either integrated directly onto the motherboard or added via expansion cards. PCI buses fully support cards that were developed for standard I/O buses.
	PCI Express		PCI express (PCIe) fits common system architectures, provides greater speed and independence, and increases bandwidth and scalability. PCIe offers 4 Gbps of peak bandwidth per direction and 8 Gbps of concurrent bandwidth. PCIe is referred to as a third-generation input / output (3GIO).
	PCMCIA / CardBus		PCMCIA devices (PC cards) are credit-card-sized peripherals predominantly used in laptop computers. The PCMCIA adapter takes the place of a COM port on a standard bus. The card is plugged into a 68-pin host socket that is connected either to the motherboard or an expansion bus. An adapter then translates the PCMCIA signals into signals usable by the computer's bus.
	PCM		Pulse code modulation (PCM).
	PECL		Positive emitter coupling logic (LVPECL).
	RS232		RS232 is a standard interface approved by the Electronic Industries Association (EIA) for connecting serial devices. This popular, serial communications standard provides asynchronous communication capabilities with hardware flow control, software flow control, and parity checking. Most gears, instruments with digital control interfaces, and communication devices have an RS232 interface. The typical transmission speed for RS232 is 9600 bps at 15 m.
	RS422		RS422 supports multipoint connections whereas RS423 supports only point-to-point connections. RS422 provides much longer transmission distances than RS232, but less signal line. RS422 uses a differential transmission technology and provides high-speed transmissions up to 10 Mbps over a maximum transmission distance up to 1.2 km at 110 kbps.
	RS485		RS485 is almost identical to RS232 except that transmissions are three-way rather than two-way. RS485 is often used in applications where a single controller needs to control multiple devices. Up to 64 devices may be connected with RS485. An enhanced version of RS422, RS485 is compatible with the RS422 interface and provides a two-wire bus topology. Using an RS485 two-wire bus provides a very inexpensive network system; however, RS485 defines only the electronic signal specifications. Consequently, users must define the software protocol for RS485 two-wire communications.
	SLIC		Subscriber line interface circuits (SLIC).
	SPI		Serial peripheral interface (SPI).
	UART		Universal asynchronous receiver transmitter (UART).
	USB		Universal serial bus (USB) is a 4-wire, 12-Mbps serial bus for low-to-medium speed peripheral device connections to personal computers (PC), including keyboards, mice, modems, printers, joysticks, audio functions, monitor controls, etc. The USB design is standardized by the USB Implementers Forum (USBIF), an organization that includes leading companies from the computer and electronics industries. The current USB specification is USB 2.0, which supports data transfer rates of up to 480 Mbps.
	USB On-The-Go		USB on-the-go (USB OTG) is an expanded USB 2.0 specification. It is designed to overcome the shortcomings of the original USB 2.0 standard.
	VME		VersaModule Eurocard bus (VMEbus) is a popular, 32-bit bus used in industrial, commercial and military applications. The VMEbus is based on the VME standard, which defines mechanical specifications such as board dimensions, connector specifications and enclosure characteristics, as well as the electronic specifications for sub-bus structures, signal functions, timing, signal voltage levels, and master/slave configurations. The VMEbus uses 3U and 6U Eurocard, rugged circuit boards that provide a 96-pin plug instead of an edge connector for durability. Several VMEbus varieties are available.
	Other		Other unlisted or proprietary interface types.
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Performance


	Supply Voltage:
	Your choices are...
	-5 V		Devices operate with -5 V.
	-4.5 V		Devices operate with -4.5 V.
	-3.3 V		Devices operate with -3.3 V.
	-3 V		Devices operate with -3 V.
	1.2 V		Devices operate with 1.2 V.
	1.5 V		Devices operate with 1.5 V.
	1.8 V		Devices operate with 1.8 V.
	2.5 V		Devices operate with 2.5 V.
	2.7 V		Devices operate with 2.7 V.
	3 V		Devices operate with 3 V.
	3.3 V		Devices operate with 3.3 V.
	3.6V		Devices operate with 3.6 V.
	5 V		Devices operate with 5 V.
	Other		Other unlisted supply voltages.
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	Data Rate		The rate or transmission of reception, in bits per second (bps).
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	Sensitivity		Sensitivity is a measure used to indicate the quality of a receiver. It is defined as the minimum input signal at the receiver to produce an acceptable output signal as specified by a desirable signal-to-noise (S/N) ratio. It is normally measured in dBm.
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	P_d		The power dissipated by the device while in the on state.
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	T_J		The full-required range of ambient operating temperatures.
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	ISM Band
	Your choices are...
	902 - 928 MHz		The device operates in the Industry, Science and Medicine (ISM band of 902 - 928 MHz. This is also called the 915 MHz band.
	2.400 - 2.500 GHz		The device operates in the Industry, Science and Medicine (ISM band of 2.400 - 2.500 GHz. This is also called the 2450 MHz band.
	5.725 - 5.875 GHz		The device operates in the Industry, Science and Medicine (ISM band of 5.725 - 5.875 GHz. This is also called the 5800 MHz band
	Other		Other unlisted or proprietary band.
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Packaging


	IC Package Type:
	Your choices are...
	Bare Die		Devices are sold in semiconductor die form. They do not have a case or packaging.
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	FCBGA		Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints.
	PBGA		Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
	MCM-PBGA		Multi-chip module plastic ball-grid array (MCM-PBGA).
	SBGA		Super ball-grid array (SBGA) provides a high-power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance).
	TBGA		Tape ball-grid array (TBGA).
	CPGA		Ceramic pin-grid array (CPGA).
	PPGA		Plastic pin-grid array (PPGA).
	FCPGA		Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown, without any wire bonding.
	IPGA		Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA.
	PGA		Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	FCCSP		Flip-chip chip-scale package (FCCSP).
	SuperFC®		Super flip-chip or SuperFC® packages feature a controlled bond line die attached directly to a copper heat spreader. SuperFC® is a registered trademark of Amkor.
	UCSP		Ultra chip scale package (UCSP).
	WLCSP		Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction.
	LGA		Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	LQFP		Low quad flat package (LQFP).
	TQFP		Thin quad flat package (TQFP).
	PQFP		Plastic quad flat package (PQFP).
	QFN		Quad flat non-leaded package (QFN) is also known as QFNL.
	VQFP		Very thin quad flat package (VQFP).
	MSOP		Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar coded. Reels are placed inside barcode-labeled boxes for shipping.
	PSOP		Power small outline package (PSOP).
	SOP		Small outline package (SOP).
	QSOP		Quarter size outline package (QSOP).
	MLP		Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm.
	SOIC		Small outline integrated circuit (SOIC).
	TSOJ		Thin small outline J-leaded package (TSOJ).
	TSOP Type I, Type II		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	TSOP Type I		Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	TSOP Type II		Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	SSOP		Shrink small outline package (SSOP).
	VSSOP		Very thin shrink small outline package (VSSOP).
	TVSOP		Thin very small outline package (TVSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	HSOP		Small Outline with Heat Sink Package.
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
	SIP		Single in-line package (SIP) is a semiconductor package which has only one row of pins.
	SDIP		Shrink dual in-line package (SDIP).
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited.
	SZIP		Shrink zigzag in-line package (SZIP).
	TDFN		Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages.
	SOT23		SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
	Other		Other unlisted, specialized, or proprietary IC packages.
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	Pin Count		The number of pins in the package.
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	Number of Devices in Package		The total number of devices in the IC package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

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