Switched capacitor filters are clocked devices. The input signal is sampled at a high rate and it is processed discretely rather than in a continuous time basis.
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Bessel filters are active filters with a passband that maximizes the group delay at zero frequency, thus showing a constant group delay in the passband. Group delay is a measurement of the time it takes for a signal to move between two points in a network. A constant group delay in the passband of filters implies that for all signals with frequencies in the passband the time delay will be the same. This fact is important in many applications, in particular in audio, video and radar applications.
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The device is designed to meet standards for temperature and other specifications for portable devices applications, such as PDAs, digital cameras, cell phones, etc.
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The filter type determines the specified frequency (Fc). For bandpass and band reject filters, the specified frequency is the center frequency. For low pass filters, the specified frequency is the cut-off frequency. For high pass filters, the specified frequency is the cut-on frequency.
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Supply Voltage (VS) refers to the source voltage range.
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Operating Temperature is the value as specified by level (minTypMax) of the ambient temperature (in °C) in which this item was designed to operate.
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Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications.
Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping.
SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
This refers to other unlisted, specialized, or proprietary packages.
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Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
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End of Life Vehicles (ELV) Directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of 7/01/2003. Lead can still be used as an alloying additive in copper, steel and aluminum and in solderable applications.
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