Supply voltage (VS) refers to the source voltage range.
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Common mode rejection ratio (CMRR) measures an amplifier's ability to reject input voltages that are common to both of its input terminals. CMRR is defined as the ratio of the differential gain to the common gain. Typically, this value is measured in decibels.
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An amplifier's power bandwidth or large-signal bandwidth refers to the device's ability to provide a maximum output voltage swing with increasing frequency. At certain frequencies, the output becomes slew-rate limited and begins to degrade. This frequency is the upper limit of the power bandwidth. The output voltage at this frequency is the peak output swing of the amplifier.
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Input offset voltage (VOS) is the differential DC voltage required at the op-amp's two inputs in order force the output voltage to zero. This occurs when no load is connected to the amplifier.
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Operating temperature is specified by level (minTypMax) of the ambient temperature (in °C) in which the amplifier was designed to operate
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Class A amplifier designs are output stage devices that pass currents at all times, even when the input stage is idle. Since the output stages are always "active", presence of an input signal causes output current to be diverted directly to the loudspeakers. The slew rate is very quick and there is only a small delay between the introduction of signal at the amplifier's inputs and outputs. If all stages of the amplifier are biased in Class A mode, and the amplifier produces all currents at its output, regardless of input signal. Because of the full-bias-current-on state of Class A amplifiers, they are the most inefficient of all designs; however, Class A amplifiers are the most linear.
AB amplifiers are a combination of Class A and Class B operations. An amplifier is said to be in Class AB operation if the amplifier operates in Class A for part of its output, and turns on an additional current for the rest of its output. The amplifier's slew rate is slower in Class AB operations than in Class A because there is a measurable length of time between the appearance of input signal and the appearance of output signal. The Class AB amplifier type is the most popular due to its increased efficiency and excellent linearity.
Class B operations are essentially the opposite of Class A operation. No currents flow when the output devices are idle, and thus must turn on from a zero-current state when signal is present. In addition, both output devices (negative and positive) are never active at the same time. If given a sine wave, each output device will operate for half the waveform. Thus, the Class B operation is very efficient; however, the linearity of the amplifier suffers when the signal approaches the point at which the output devices change. Class B operation amplifiers are not generally used for professional audio equipment, and are reserved for low-power operations such as radios.
Class C amplifiers are used for radio-frequency transmissions. This class is similar to Class B operations in that each output stage device (negative, positive) is turned on for less than one-half cycle, and pulsed on and off through the duration of the half-cycle. Class C amplifiers can produce large amounts of output power, although the distortion is great. RF circuitry has been developed and tuned to alleviate the effects of this distortion.
Class D refers to an amplifier design that is also switched. The output devices are switched on and off at least twice per cycle. Because the output devices (negative and positive) are completely on or completely off, no power is dissipated. Real-life Class D amplifiers are not 100% efficient, but approach 90%.
Class E operation involves amplifiers designed for rectangular input pulses, not sinusoidal audio waveforms. The output load is a tuned circuit, with the output voltage resembling a damped single pulse.
Class G operation involves changing the power supply voltage from a lower level to a higher level when larger output swings are required. There are several ways to do this; the simplest involves a single class AB output stage that is connected to two power-supply rails by a diode or a transistor switch. This design is for most musical program material; the output stage is connected to the lower supply voltage, and automatically switches to the higher rails for large signal peaks (thus the nickname rail-switcher). Another approach uses two class AB output stages, each connected to a different power supply voltage, with the magnitude of the input signal determining the signal path. Using two power supplies improves efficiency enough to allow more power for a given size and weight. Class G is becoming common for pro-audio designs.
Class H operation takes the Class G design one step further and actually modulates the higher power supply voltage through the input signal. This allows the power supply to track the audio input and provide just enough voltage for optimum operation of the output devices. The efficiency of Class H is comparable to Class G designs.
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Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications.
Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping.
SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
This refers to other unlisted, specialized, or proprietary packages.
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Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
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The End of Life Vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of July 1, 2003. Lead can still be used as an alloying additive in copper, steel, aluminum, and in solderable applications.
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