Supply voltage (VS) refers to the source voltage range.
Search Logic:
User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
Input offset voltage (VOS) is the differential DC voltage required at the op-amp's two inputs in order force the output voltage to zero. This occurs when no load is connected to the amplifier.
Search Logic:
All matching products will have a value less than or equal to the specified value.
Switching frequency is the maximum switching frequency that can be sustained without exceeding the specifications. A high switching frequency (PWM) allows smaller output filters to be built into the amplifier enclosure. This design saves power, heat, and space.
Search Logic:
All matching products will have a value greater than or equal to the specified value.
Operating temperature is specified by level (minTypMax) of the ambient temperature (in °C) in which the amplifier was designed to operate
Search Logic:
User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications.
Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping.
SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
This refers to other unlisted, specialized, or proprietary packages.
Search Logic:
All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Product planning or design is underway. Samples may or may not exist. Specification changes may occur and planned introduction dates may be delayed. Orders and product shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model.
Production is beginning to ramp up. Limited quantities are available. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
Production is increasing rapidly. Manufacturing capacity is being added. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
Product growth has stabilized or peaked. Product quality is very high. Orders and shipments are permitted. Product is recommended for use in new designs. This stage is part of the EIA-724 product life cycle data model.
Capacity is beginning to decline. Orders and shipments are permitted, but devices are not recommended for new designs. This stage is part of the EIA-724 product life cycle data model.
Capacity is declining rapidly. A formal discontinuance notice may be issued. Limitations on shipments can occur, but orders are still allowed. Devices are not considered for new designs. This stage is part of the EIA-724 product life cycle data model.
Final shipments are made for existing orders. New orders are limited to existing or residual inventories. Manufacturing capacity limitations may exist. This stage is not part of the EIA-724 product life cycle data model.
Devices are unavailable. Product inventories and all supporting hardware, software, and documentation have been removed. New orders and new shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model.
All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
Search Logic:
"Required" and "Must Not Have" criteria limit returned
matches as specified. Products with optional attributes
will be returned for either choice.
The End of Life Vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of July 1, 2003. Lead can still be used as an alloying additive in copper, steel, aluminum, and in solderable applications.
Search Logic:
"Required" and "Must Not Have" criteria limit returned
matches as specified. Products with optional attributes
will be returned for either choice.
