Video processors IC are semiconductor devices used to process video images for a wide range of applications. These integrated circuits (ICs) are designed to display analog and/or digital signals while eliminating multi-path interference and adjacent-channel noise. Video processors IC may also provide high-definition (HD) decompression, pixel-based video analysis, adaptive pixel interpolation, and advanced field merging functions to eliminate problems caused by interlaced coding. Some video processing chips can decode two or more simultaneous standard-definition (SD) signals. Others comply with digital television standards from organizations such as the Advanced Television Systems Committee (ATSC) and the European Digital Video Broadcasting (European DVB). Support for cathode ray tubes (CRTs) and flat panel devices may also be available with some video processors IC.

Video processors IC are available in a variety of integrated circuit (IC) package types. Dual in-line packages (DIP) can be made of ceramic (CIP) or plastic (PDIP). Quad flat packages (QFPs) contain a large number of fine, flexible, gull wing shaped leads. SC-70, one of the smallest available IC packages, is well-suited for applications where space is extremely limited. Small outline (SO) packages are available with 8, 14, or 20 pins. Transistor outline (TO) packages are commonly available. TO-92 is a single in-line package used for low power devices. TO-220 is suitable for high power, medium-current, and fast-switching products. TO-263 is the surface-mount version of the TO-220 package. Other IC packages for video processors IC include shrink small outline package (SSOP), small outline integrated circuit (SOIC), small outline package (SOP), small outline J-lead (SOJ), discrete package (DPAK), and power package (PPAK).

Video processors IC are semiconductor devices used to process video images for a wide range of applications. These integrated circuits (ICs) are designed to display analog and/or digital signals while eliminating multi-path interference and adjacent-channel noise. Video processors IC may also provide high-definition (HD) decompression, pixel-based video analysis, adaptive pixel interpolation, and advanced field merging functions to eliminate problems caused by interlaced coding. Some video processing chips can decode two or more simultaneous standard-definition (SD) signals. Others comply with digital television standards from organizations such as the Advanced Television Systems Committee (ATSC) and the European Digital Video Broadcasting (European DVB). Support for cathode ray tubes (CRTs) and flat panel devices may also be available with some video processors IC.

Video processors IC are available in a variety of integrated circuit (IC) package types. Dual in-line packages (DIP) can be made of ceramic (CIP) or plastic (PDIP). Quad flat packages (QFPs) contain a large number of fine, flexible, gull wing shaped leads. SC-70, one of the smallest available IC packages, is well-suited for applications where space is extremely limited. Small outline (SO) packages are available with 8, 14, or 20 pins. Transistor outline (TO) packages are commonly available. TO-92 is a single in-line package used for low power devices. TO-220 is suitable for high power, medium-current, and fast-switching products. TO-263 is the surface-mount version of the TO-220 package. Other IC packages for video processors IC include shrink small outline package (SSOP), small outline integrated circuit (SOIC), small outline package (SOP), small outline J-lead (SOJ), discrete package (DPAK), and power package (PPAK).

Packing methods for video processors IC consist of tape reel, rail, bulk pack, and tube technologies. The tape reel method packs components in a tape system by reeling specified lengths or quantities for shipping, handling, and configuration in industry-standard automated board-assembly equipment. Rail, another standard packing method for video processors IC, is typically used only in production environments. Bulk pack devices are distributed as individual parts, while tray components are shipped in trays. The tube or stick magazine method is used to feed video processors IC into automatic placement machines for through-hole or surface mounting.