IC analog crosspoint switches are used for routing high speed signals such as video and audio signals. They are used in many different applications, and vary in terms of configuration and performance. IC analog crosspoint switches are available in six basic configurations: 8x8, 16x4, 16x8, 16x16, 32x 16, and 32x32. For each configuration, the first number represents the numbers of inputs and the last number represents the number of output crosspoint. Performance specifications for IC analog crosspoint switches consist of supply voltage, bandwidth, slew rate, maximum crosstalk, and operating ambient temperature. Supply voltage is the source voltage range. Bandwidth is the device’s ability to provide a maximum output voltage swing with increasing frequency. Slew rate is the rate of change of the output voltage in response to a step input. Maximum crosstalk is measured in decibels (dB) and represents the channel-to-channel crosstalk between any two analog inputs.
IC analog crosspoint switches differ in terms of applications and features. Some products are designed for audio, automotive, avionics, commercial, communications, computers, or data acquisition applications. Others meet mechanical, electrical and environmental requirements for industrial, medical, military, or video applications. IC analog crosspoint switches for portable devices and universal serial bus (USB) products are also available. In terms of features, IC analog switches may incorporate fault-tolerant protection, short circuit protection, thermal protection, or on-chip electrostatic discharge (ESD) protection. Bilateral switches allow signals to be transmitted in either direction. Chip-enabled switches can be enabled or disabled by applying a logic signal to the chip enable (CE) pin. IC analog crosspoint switches with serial inputs and undervoltage lockouts provide additional flexibility and protection.
IC analog crosspoint switches are used for routing high speed signals such as video and audio signals. They are used in many different applications, and vary in terms of configuration and performance. IC analog crosspoint switches are available in six basic configurations: 8x8, 16x4, 16x8, 16x16, 32x 16, and 32x32. For each configuration, the first number represents the numbers of inputs and the last number represents the number of output crosspoint. Performance specifications for IC analog crosspoint switches consist of supply voltage, bandwidth, slew rate, maximum crosstalk, and operating ambient temperature. Supply voltage is the source voltage range. Bandwidth is the device’s ability to provide a maximum output voltage swing with increasing frequency. Slew rate is the rate of change of the output voltage in response to a step input. Maximum crosstalk is measured in decibels (dB) and represents the channel-to-channel crosstalk between any two analog inputs.
IC analog crosspoint switches differ in terms of applications and features. Some products are designed for audio, automotive, avionics, commercial, communications, computers, or data acquisition applications. Others meet mechanical, electrical and environmental requirements for industrial, medical, military, or video applications. IC analog crosspoint switches for portable devices and universal serial bus (USB) products are also available. In terms of features, IC analog switches may incorporate fault-tolerant protection, short circuit protection, thermal protection, or on-chip electrostatic discharge (ESD) protection. Bilateral switches allow signals to be transmitted in either direction. Chip-enabled switches can be enabled or disabled by applying a logic signal to the chip enable (CE) pin. IC analog crosspoint switches with serial inputs and undervoltage lockouts provide additional flexibility and protection.
Integrated circuit (IC) package type, pin count, and the number of packaged devices are additional parameters to consider when specifying IC analog crosspoint switches. Dual in-line packages (DIP) come in both ceramic (CDIP) and plastic (PDIP) designs. IC analog crosspoint switches also use single in-line packages (SIP) and small outline IC (SOIP). Choices for IC package type may include chip scale package (CSP), small outline package (SOP), quad flat package (QFP), transistor outline (TO), and plastic leaded carrier (PLCC). For many IC package categories, several options are available. For example, small outline packages (SOP) are available as shrink small outline package (SSOP), mini small outline plastic package (MSOP), and power small outline package (PSOP).
