|
|
|
Welcome to GlobalSpec - a trusted source for engineers and industrial professionals.
Search GlobalSpec to find Silicon MEMS-related products, suppliers, datasheets and CAD.
 |
Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Products/Services for Silicon MEMS
MEMS foundry services suppliers design and manufacture microelectromechanical devices on a contract basis, in prototype to production quantities. Search by Specification | Learn More about MEMS Foundry
MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer. Learn More about MEMS Devices
MEMS processing equipment is used to create micro-electro-mechanical systems (MEMS) sensors and wafers. Learn More about MEMS Processing Equipment
...in prototype to production quantities. Some companies produce silicon wafers for analog devices, application-specific integrated circuits (ASIC), high voltage components, logic gates, microprocessors, or computer memory. Others fabricate chips and wafers... Search by Specification | Learn More about Semiconductor Foundry Services
...of the substrate or wafer. Plasma ashing, plasma cleaning, sputter etching, sputter precleaning or ion milling are processes that use plasma to remove layers of material from a substrate or wafer for cleaning purposes. In rapid thermal processing (RTP), silicon... Search by Specification | Learn More about Thin Film Equipment
Silicon controlled rectifiers (SCR) are four-layer (PNPN) thyristors with three terminals: an input control terminal (gate), an output terminal (anode), and a terminal common to both the input and output (cathode). SCRs are used mainly with high Search by Specification | Learn More about Silicon Controlled Rectifiers (SCR)
...structure or crystal orientation of epitaxial thin-films of silicon or other materials. X-ray diffractometers are semiconductor metrology instruments that are employed to unambiguously determine crystal structure, crystal orientation, film thickness... Search by Specification | Learn More about Semiconductor Metrology Instruments
...semiconductor piezoresistive, piezoelectric (including dynamic and quasistatic measurement), microelectromechanical systems (MEMS), vibrating elements (silicon resonance, for example), and variable capacitance. Other variations within pressure sensors... Search by Specification | Learn More about Pressure Sensors
...many times within an enclosure. Spinning mass gyros use a steadily-moving mass with a free-moving axis (gimbal). Vibrating gyros use micro-electro-mechanical system (MEMS) technology and a vibrating, quartz tuning-fork to measure Coriolis force... Search by Specification | Learn More about Inertial and Gyro Systems
Tilt sensors, switches and inclinometers generate an artificial horizon and measure angular tilt with respect to this horizon. They are used in cameras, aircraft flight controls, automobile security systems, and special switches. Search by Specification | Learn More about Tilt Sensors, Switches and Inclinometers
...microelectronic devices and optoelectronic devices such as transistors, photodetectors and solar cells. Silicon (Si) is the most commonly used semiconductor material today; however, other semiconductor material types are also available. The number of valence... Learn More about Semiconductors and Semiconductor Materials
Ceramic abrasives and media include aluminum oxide, boron carbide, cubic boron nitride (CBN), cerium oxide, fabricated diamond, silicate, silicon carbide, tin oxide, tungsten carbide, zirconia, and other fused or sintered crystalline inorganic Search by Specification | Learn More about Ceramic Media and Abrasives
Carbides and carbide materials include silicon carbide, tungsten carbide and titanium carbide as well as other compounds of a metal (Ti, W, Cr, Zr) or metalloid (B, Si) and carbon. Carbides have excellent wear resistance and high hot hardness Learn More about Carbides and Carbide Materials (Hard metals)
Industrial ceramic materials are non-metallic, inorganic compounds that include oxides, carbides, or nitrides. They have high melting points, low wear resistance, and a wide range of electrical properties. Search by Specification | Learn More about Industrial Ceramic Materials
...is also combined with emery and crocus to produce abrasives suitable for finishing applications. Other types of abrasive grains include garnet, tungsten carbine, silicon carbide, and alumina-zirconia. Super-abrasive diamond pastes are useful... Search by Specification | Learn More about Coated Abrasives
|
||||||||
Micro-Optical Element Solutions- USI Photonics Universal Semiconductor, Inc.
PVD Sputtered Metals Available for Silicon Wafers Rogue Valley Microdevices, Inc.
Evaporated Metals available for metal lift-off Rogue Valley Microdevices, Inc.
Targeted Stress LPCVD Nitride - Customer Specific Rogue Valley Microdevices, Inc.
MEMS Device Fabrication Merit Sensor Systems
Thermal Oxidation up to 15 microns Rogue Valley Microdevices, Inc.
|
Product News for Silicon MEMS
MEMS LandMark20 AHRS - Low Noise Angle Output AHRS
The all new MEMS LandMark20 MEMS AHRS is a low noise AHRS (Attitude and Heading Reference System) with excellent bias that provides internally temperature compensated RS485 output of angles, heading, altitude, delta velocity, delta theta and features ultra-low power consumption, small size and light weight. A complete turnkey software development kit is also available. (read more)
LandMarkTM 30 MEMS IMU "LN Series"
The "LN Series" version of our LandMarkTM 30 IMU is our premium performance option featuring exeptionally low gyro noise 0.007º/sec/√Hz and outstanding 10°/hour in-run bias. It provides internally temperature compensated output of delta velocity and delta theta and input power from +6VDC to +36VDC for use in both automotive and aerospace applications. (read more)
MEMS Landmark 20 Low Noise IMU
The all new LandMark20 MEMS IMU is a low noise digital Inertial Measurement Unit (IMU) with excellent bias stability that provides internally temperature compensated RS485 output of delta velocity and delta theta. A complete turnkey software development kit with advanced features including direct PC interface, data recording, bandwidth and output rate selection is also available. (read more)
MEMS LandMark20 GPS/AHRS - Low Noise AHRS with GPS
The all new LandMark20 MEMS GPS/AHRS is an ultra low power combined digital Attitude and Heading Reference System (AHRS) that provides internally temperature compensated RS485 output of delta velocity, delta theta, heading, pitch and roll angle and altitude information and a 16 channel C/A code GPS receiver with 10Hz position update rate. A complete turnkey SDK is also available. (read more)
MEMS Tilt Sensor featuring micro g bias stability
Colibrys releases one of the world's highest stability ±3g full range accelerometer commercially available, the RS9003.A. (read more)
Mems- Micro-Electro-Mechanical Systems
Mems- Micro-Electro-Mechanical Systems from Universal Semiconductor, Inc. USI offers rugged, miniature, and high sensitivity MEMS process capability for manufacture of sensors, transducers, switches, mirrors, and many diverse special custom designed products that go into wide ranging applications from medical to aerospace. (read more)
MEMS sensor chip, Micro-Electro-Mechanical Systems
The MEMS integrated sensor chip can be readily combined with a signal conditioning circuitry chip for amplification, offset compensation, linearity improvement, and temperature compensation. All parameters for amplification, offset compensation, linearity improvement, and temperature compensation are stored in an internal EEPROM. No additional components required.... (read more)
MEMs Gas Sensor
The USI thermal conductivity gas sensor incorporates advanced design innovations in MEMS (Micro-Electrical-Mechanical-Systems), and was developed and manufactured in Silicon Valley (read more)
New Series of MEMS Shock Accelerometers
PCB Piezotronics, Inc., introduces a new series of MEMS shock accelerometers. PCB® Series 3991/3501 MEMS shock accelerometers represent state-of-the-art industry technology for miniature, high-amplitude, DC response acceleration sensors, capable of measuring long duration transient motion, as well as responding to and surviving extremely fast rise times typical of high-g shock events. (read more)
PECVD SiC Thin Film for Silicon Wafers
Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)
Conduct Research
-
MEMS and medicine
Using technology borrowed from the semiconductor industry, companies are putting micron-sized components inside medical and biochemical devices. In this MEMS device built at Sandia National...(read more)
-
MEMS and medicine
Using technology borrowed from the semiconductor industry, companies are putting micron-sized components inside medical and biochemical devices. In this MEMS device built at Sandia National...(read more)
-
MEMS Capacitive Accelerometers In Harsh Environments (.pdf)
One of the general trends in the MEMS sensors business is the utilisation of the technology in harsh environments, where high temperature, shock, vibration, atmosphereic (ESD, radiation, chemistry...)...(read more)
-
Current Capabilities of MEMS Capacitive Accelerometers in Harsh Environment (.pdf)
One of the general trends of the MEMS sensors business is the utilization of the technology to satisfy harsh environment requirements (temperature, shock, vibration, environment, security). The...(read more)
-
Advances in Silicon Technology Enables Replacement of Quartz-Based Oscillators
With a market size estimated at more than $650M and more than 1.4B crystal oscillators supplied annually, quartz crystal oscillators have long been the preferred choice for clock generation in...(read more)
-
Packaging microscopic machines
Although MEMS technology is considered fundamentally ready for prime time, packaging hasn’t kept pace. But that’s changing as an estimated 900 packaging patents will be filed this year...(read more)
-
LIGA
LIGA, a German acronym for x-ray lithography (lithographie), electroplating (galvanoformung), and molding (abformung), is used to fabricate high aspect-ratio structures in micro-electromechanical...(read more)
-
Shedding New Light On Tiny Packages
Welds 0.1 mm wide? No problem. Recent laser transmission welders join plastic components with unprecedented precision. These micrographs show seams made with the mask welding procedure. The gray...(read more)
-
Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers
Laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention in recent years. High precision laser cutting and drilling processes have been...(read more)
|
Sandia MEMS Home Page MicroElectroMechanical Systems (MEMS) Welcome to the Silicon-Based MEMS site at Sandia National Laboratories. |
|
|
SILICON MICROSTRUCTURES INC.: Home Founded in 1991, Silicon Microstructures, Inc. is a premier developer and manufacturer of MEMS-based pressure sensors for a range of markets, with See Silicon Microstructures, Inc. Information |
|
|
Microelectromechanical systems - Wikipedia, the free... of cheap high-quality materials and ability to incorporate electronic functionality make silicon attractive for a wide variety of MEMS applications. |
|
|
Development and Optimization of Integrative MEMS-Based... Development and Optimization of Integrative MEMS-Based Gray-Scale Technology in Silicon for Power MEMS Applications See Storming Media LLC Information |
|
|
Silicon MEMS Technology DTU Nanotech > Forskning > MicroElectroMechanical Systems (MEMS) > Silicon Microtechnology > Silicon MEMS Technology |
|
|
Infineon Unveils Miniature Silicon Microphone Using MEMS... Infineon Unveils Miniature Silicon Microphone Using MEMS Technology to Match the Acoustic Properties of Larger Devices While Using One-third Power; See Infineon Technologies Corporation Information |
|
|
Silicon Microphone - Infineon Technologies Silicon Microphone The microphone sensors are based on the semiconductor MEMS (Micro Electro Mechanical Systems) technology. See Infineon Technologies Corporation Information |
|
|
Silicon Sense : Connects semiconductor materials and custom... We are able to provide silicon and germanium from test wafers to higher grade custom foundry/fabrication technologies, related to MEMS, ASIC, CMOS or |
|
|
Silicon wafer producers and suppliers - Where to buy silicon... Cemat Silicon S.A. Cemat Silicon S.A., 133 Wolczynska St., 01-919, Warsaw, Poland e-mail: Marketing &Sales, |
|
|
Society of Manufacturing Engineers Measurements in Micro-Scratching of Silicon: Toward Optimal Thermal Modeling of Ductile Regime Machining for MEMS/NEMS |
More >>
