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Semiconductor Manufacturers on GlobalSpec

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Semiconductor Manufacturers

Semiconductors

Integrated circuits, ICs, and other solid state components.

Analog and Mixed Signals (580 companies) - Analog and mixed signal ICs are integrated circuits in which many discrete logic and/or analog components are fabricated on a single chip of semiconductive material and packaged in a single case to form a functional unit.
Audio and Video IC (122 companies) - Audio and Video ICs are integrated circuit components that are designed for audio, video and multimedia applications.
Communication IC (1279 companies) - Communication ICs are integrated circuits used in general telecommunication electronic modules that enable the transmission, reception and analysis of data and signals.
Circuit Protection Devices (162 companies) - Circuit protection devices are used to protect electronic components from unwanted transients such as current and voltage surges, electrostatic discharge (ESD), lightning, spikes and other signals that can imperil the operation or damage the component.
Discrete (841 companies) - Discrete ICs are integrated circuits that contain only one type of electronic component (i.e., transistors or diodes).
IC Interface Devices (426 companies) - IC interface devices or gate drivers provide the required current and voltage necessary to switch or power an electronic component based on the output signals from a logic device.
IC Optoelectronics (1266 companies) - IC optoelectronics are integrated circuits that combine optical components (i.e. laser optocoupler, LEDs, etc.) with electronic devices or circuits (i.e. transistors, diodes, etc.).
Lab-on-a-Chip (LOC) Devices (10 companies) - Lab-on-a-chip (LOC) devices are integrated semiconductors that serve as a laboratory for the testing and analysis of very small chemical and clinical samples.
Logic (194 companies) - Logic devices are integrated circuits that perform logic operations using Boolean logic.
Memory Chips (474 companies) - Memory chips are integrated circuits that temporarily store data and code for processing.
MEMS Devices (14 companies) - MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer.
Microprocessors and Microcontrollers (617 companies) - Microprocessors and microcontrollers are IC chips that perform arithmetic and logic operations.
Passive (1090 companies) - Passive IC components do not amplify signals and do not require any power (bias) to operate. Examples of these devices include resistors, inductors, potentiometers, and capacitors.
Power and Power Management IC (626 companies) - Power and power management ICs are used to monitor, control, apply, and distribute power to systems such as microprocessors.
Programmable Logic Devices (315 companies) - Programmable logic devices have configurable logic and flip-flops linked together by programmable interconnects. Memory cells control and define the functions that the logic performs, and how the various logic functions are interconnected. 
Semiconductor Foundry Services (182 companies) - Semiconductor foundry services suppliers design and manufacture semiconductor chips on a contract basis, in prototype to production quantities.  Learn more about Semiconductor Foundry Services
Sensor Chips (189 companies) - Sensor chips are integrated circuits or dies incorporating semiconductor circuit elements that are used to detect and/or respond to changes in some physical parameter and convert it to an electrical signal.
Timing Circuits (677 companies) - IC timing devices are integrated circuits that generate, control, keep, and apply time and frequency to electronic systems.


Semiconductors are the heart of microprocessor chips as well as transistors. Almost all products that depend upon electronics, microwaves and RF signals are dependant upon semiconductors. The main material component of almost all semiconductor chips and transistors is silicon, which is used because of its crystalline structure. Silicone chips can be turned into a conductor by adding other materials to it. These materials add certain impurities, which as a classification are referred to as "doping." Doping creates two consistent types of impurities, which vary depending upon the materials added.

N-type doping is achieved when phosphorus or arsenic are added. Both phosphorus and arsenic release free electrons, because a fifth electron in each element cannot bond to the crystal lattice of silicon. This allows an electrical current to flow through the silicon network with a negative charge, which lends itself to the N-type naming.

P-type doping uses either boron or gallium as the dopant. Both boron and gallium have only three electrons. When these three electrons bond to the silicon crystal lattice, they leave an empty silicon electron, which remains unbound. This unbound electron allows a positive charge to flow through the crystal, hence the name P-type.

Semiconductors are divisible into three main categories, diodes, transistors and chips,

Diodes are the simplest semiconductor devices. They allow current to flow in only one direction, completely preventing the opposite flow. Diodes are designed with a two-layer structure, one layer a p-type semiconductor, the other an n-type.

Transistors are created by using three layers rather than the two layers used in a diode. They are designed in either an NPN or a PNP configuration. Transistors can be used as switches or amplifiers.

Silicon chips are composed thousands of transistors embedded into the silicon structure. These transistors when acting as switches, create Boolean gates, which are used in microprocessor chips.

Categories within the Semiconductors family include analog linear devices, communications and telecommunications chips, data acquisition chips, data converter chips, digital logic devices, diodes, IC interface devices, IC passive components, IC timing devices, memory chips, microprocessors and microcontrollers, power management chips, programmable logic devices, rf and wireless IC chips, sensor chips, thyristors, transistors, and video, audio, multimedia chips.


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